Application of VINNAPAS® Resin in Adhesives

Thanks to its superior adhesion to numerous substrates such as paper, cardboard, wood, textiles, leather, glass, stone, metals and plastics, VINNAPAS® solid resin is widely adopted as a core base material in the adhesive industry.

Solvent-based Adhesives

VINNAPAS® solid resin can be formulated with mild solvents including esters, ketones and water-based alcohols. In the United States, acetone, methyl acetate and tert-butyl acetate (TBAc) are known as exempt solvents, since they hardly generate ground-level ozone and smog. Therefore, the US Environmental Protection Agency (US EPA) has excluded these exempt solvents from VOC regulatory definitions. Owning excellent solubility in acetone, methyl acetate and tert-butyl acetate, VINNAPAS® solid resin is an ideal base material for preparing adhesives that meet VOC limit standards for the U.S. market. The VINNAPAS® N series is applicable to adhesives with no specific heat resistance requirements. The combination of VINNAPAS® N series and UW series together with fillers like calcium carbonate can improve heat resistance performance. VINNAPAS® N series is recommended for the production of sprayable adhesives. To manufacture VINNAPAS®-based adhesives, it is suggested to fully dissolve VINNAPAS® resin or resin blends in appropriate solvent mixtures with sufficient stirring, then add fillers, pigments and other auxiliary materials.

Plasticizer Application

Adhesives formulated with VINNAPAS® solid resin can use conventional dibenzoate plasticizers or polymeric plasticizers such as polyadipates to realize highly flexible bonding, or enhance the low-temperature flexibility of adhesives as needed. In addition, VINNAPAS® B 500-20 VLE is also available for formulation. It is an internally plasticized copolymer modified with soft vinyl laurate comonomers, supplied as a ready-to-use 50% ethyl acetate solution. VINNAPAS®-containing adhesives can be applied by traditional methods including brushing, roller coating, spraying and knife coating. They are mainly used in various multi-purpose paste construction adhesives for parquet floors, subfloors and landscape greening projects. Custom formulation guidance can be provided on demand.

Hot Melt Adhesives

Typical hot melt adhesives are mainly composed of polymer binders, tackifying resins and waxes. In hot melt systems, our thermoplastic VINNAPAS® solid resins, especially VINNAPAS® N resins, can be matched with rosin resins or hydrocarbon resins to serve as tackifiers or property modifiers. VINNAPAS® N resins are colorless, odorless and food-contact safe raw materials. Featuring outstanding cost performance in hot melt formulations, they can effectively enhance adhesion to key substrates such as PET and PP.Acrylic Structural Adhesives Free radical cured acrylic adhesives deliver extremely strong adhesion to various substrates and feature faster curing speed than epoxy resins and polyurethanes. The performance of structural adhesives relies on the properties of the adhesive layer between bonded materials. The adhesives shall have no shrinkage during curing. VINNAPAS® solid resin boasts low curing shrinkage, which speeds up processing and ensures stable and reliable bonding effect.Acrylic Structural Adhesive
Free radical cured acrylic adhesives boast strong adhesion to various substrates and cure faster than epoxy resins and polyurethanes. The performance of structural adhesives is determined by the properties of the bonding layer between bonded materials. Adhesives must not shrink during curing. Solid VINNAPAS® resins deliver low shrinkage in the curing process, which speeds up processing and ensures reliable bonding performance.